SIGNIS: Softwarized Next Generation Networks for IoT Services

Workshop co-located with

IEEE Global Communications Conference (GLOBECOM)

Madrid, Spain

December 7-11, 2021


The workshop on Softwarized Next Generation Networks for IoT Services (SIGNIS) intends to leverage communication, softwarization, and learning for provisioning IoT services, with the integration of different platforms such as cloud and fog/edge computing platforms in handling the heterogeneous and numerous IoT traffic generated in the network of 6G and beyond, along with the different network architectures such as Information- and Service-Centric Networking (ICN and SCN) including Service-Oriented Network Architecture (SONA). SIGNIS aims to bring together researchers working not only on improving the network infrastructure to accommodate IoT services but also on realizing real-time IoT services in various domains such as smart cities, smart grid, vehicular networks, underwater networks, and so on. The authors are expected to share their new ideas, latest findings, and results in the following topics but not limited to:

  • Provisioning IoT services in 6G and beyond network architecture
  • Softwarization of next generation networks
  • Slicing to support heterogeneous IoT services
  • Network function virtualization (NFV) in the context of IoT services
  • Provisioning virtualized IoT services
  • Exploring ML and AI for enabling real-time IoT services
  • Resource orchestration in cloud, fog, edge networks for enabling IoT-services
  • Network management in ICN and SCN for IoT
  • Smart grid communication for heterogeneous and sporadic IoT services
  • Enabling heterogeneous and sporadic IoT services using vehicular networks
  • Transport layer issues in provision IoT services
  • Supporting multimedia-enabled IoT services
  • Business perspective of provisioning IoT services

For more information, please see IEEE GLOBECOM 2021 official website:


Workshop Organizers

Ayan Mondal
Univ Rennes, Inria, CNRS, IRISA, France

Arijit Roy
University of Luxembourg, Luxembourg

Sudip Misra
FNASc (India), FNAE (India), FIET (UK), FBCS (UK), FIETE (India), FRSPH (UK)
Indian Institute of Technology, Kharagpur, India

Workshop TPC Members

  • Xavier Fernando, Ryerson University, Canada
  • Tomohiko Taniguchi, Fujitsu Labs, Japan
  • Walid Saad, Virginia Tech, USA
  • Junyu Lai, University of Electronic Science and Technology of China, China
  • Sherali Zeadally, University of Kentucky, USA
  • Barun Kumar Saha, Hitachi ABB Power Grids, India
  • Anandarup Mukherjee, University of Cambridge, UK
  • Farid Nait-Abdesselam, University of Missouri, Kansas City, USA
  • Guillaume Pierre, University of Rennes, Inria, CNRS, IRISA
  • Ilora Maity, Aalto University, Finland
  • Petros Nicopolitidis, Aristotle University of Thessaloniki, Greece
  • Nidal Nasser, Alfaisal University, Saudi Arabia
  • Arif Ahmed, Experienced Researcher, Ericsson, Sweden
  • Sagar Naik, University of Waterloo, Canada
  • Bibudhendu Pati, Rama Devi Women's University, Bhubaneswar, India
  • Chhabi Rani Panigrahi, Rama Devi Women's University, Bhubaneswar, India
  • Nikos Parlavantzas, INSA Rennes, IRISA, Inria, France
  • Amiya Nayak, University of Ottawa, Canada
  • François Lemercier, CNRS, IRISA, France
  • Panagiotis Sarigiannidis‬, University of Western Macedonia, Greece
  • Grégoire Danoy, University of Luxembourg, Luxembourg
  • Burak Kantarci, University of Ottawa, Canada
  • Pascal Bouvry, University of Luxembourg, Luxembourg
  • Ha Nguyen Vu, University of Luxembourg, Luxembourg
  • Frédéric Pinel, University of Luxembourg, Luxembourg
  • Luca Davoli, University of Parma, Italy


The page length limit for all initial submissions for review is SIX (6) printed pages (10-point font) and must be written in English. Initial submissions longer than SIX (6) pages will be rejected without review.

All final submissions of accepted papers must be written in English with a maximum paper length of six (6) printed pages (10-point font) including figures. No more than one (1) additional printed page (10-point font) may be included in final submissions and the extra page (the 7th page) will incur an over length page charge of US$100. All final papers must be submitted to the IEEE Conference eXpress website. Please refer to the acceptance letter for the instructions on how to upload final papers.

You may also use one of the following templates for Microsoft Word: A4, US letter.

Download Standard IEEE conference templates for LaTeX formats >>

If you have any questions regarding the submission of manuscripts, please contact one of the Technical Program Chairs of the Symposia that you are submitting a paper.

For paper submission, please follow the following link:


  • Deadline for workshop paper submission: July 31, 2021 August 14, 2021 (Firm Deadline)
  • Workshop Paper Notification of Acceptance: September 15, 2021
  • Workshop Paper Camera Ready Submissions:: October 8, 2021